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Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

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Dongguan Ziitek Electronical Material and Technology Ltd.

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Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

Name: Easy Release Construction Cpu Thermal Pad Silicone 40wMk For It Infrastructure
Brand: Ziitek
Price: 0.1 USD

Quality Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure wholesale

Brand Name : Ziitek

Model Number : TIF1140-40-11US thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Application : display card

thermal conductive : 4.0W/mK

Density : 3.15g/cm3

hardness : 20 shore00

name : Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

keyword : thermal gap pad

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Easy release construction silicone pads for IT infrastructure ,4.0W/mK

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

TIF100-40-11US-Series-Datasheet.pdf

TIF1140-40-11US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

<Good thermal conductive:4.0W/mK

<Thickness:3.5mmT

<Hardness:20 Shore 00

<Colour: gray

<Outstanding thermal performance

<High tack surface reduces contact resistance

<RoHS compliant

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIF1140-40-11US
Product Name	TIF1140-40-11US Series
Colour	gray
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	3.15 g/cc
Thickness	3.5mmT
Hardness	20 Shore 00
Dielectric constant@1MHz	4.0 MHz
Continuos Use Temp	-40to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	4.0 W/mK
Volume Resistiviyt	6.0*10^{12 _Ohm-cm}

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

FAQ

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

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Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

Easy Release Construction Cpu Thermal Pad Silicone 4.0w/Mk For It Infrastructure

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