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High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

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High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

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Brand Name : Ziitek

Model Number : TIE280-12AB

Certification : RoHS

Place of Origin : China

MOQ : 10kg

Price : 1-100USD/kg

Payment Terms : T/T

Supply Ability : 10000kg/month

Delivery Time : 3-8 work days

Packaging Details : 1kg/can

material : epoxy glue

usage : bonding electronics

appearance sured : Dull Gray Solid

continuous use temp : -40 to 160℃

thermal conductivity : 1.2 W/mK

NAME : Thermal Conductive Glue

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Thermal Conductive Glue Electronic Epoxy Resin Adhesive

TIE™280--12AB is a two-component, high thermal conductivity, room-temperature curing, long working time and fireproof epoxy resin potting compound, which is especially suitable for potting capacitors and small electronic devices.

Product Summary:

TIE™280-12AB is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIE280-12AB-Series-Datasheet.pdf

Feature

Outstanding thermal performance 1.2W/mK
High tack surface reduces contact resistance
RoHS compliant
UL recognized
Fiberglass reinforced for puncture, shear and tear resistance
Easy release construction

Applications

Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices

Typical Properties of TIETM280-12A
Chemical type Epoxy Test Method
Appearance uncured Black Paste Visual
Appearance cured Dull Black Solid Visual
Components Two Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 85 Shore D ASTM 2240
Continuous Use Temp -40 to 160℃ *****
Tensile strength Al/Al @25°C >10,000psi *****
Thermal Conductivity 1.2 W/m-K ASTM D5470

Application Features:

TIE™380-12A

Color Black

Viscosity@25℃ 15,000 cPs

Shelf life @25℃° 12Months

TIE™380-12B

Color Black

Viscosity@25℃ 7,000 cPs

Shelf life @25℃° 12Months

TIE™380-12AB(Two Component Mix)

Viscosity(@25℃ )1,000 cPs

Operating time9(@ 25℃)45Minutes

Specific Gravity (@25℃) 1.6 g/cc

Shelf life( @25℃°) 12Months

Curing procedures:

Curing temperature Curing time

25℃° 3 Hours

70℃ 30Minutes

Package:

1KG A/B for each tank. 5KG A/B each. 10KG A/B each.

High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Product Tags:

Electronic Epoxy Resin Glue

      

Electronic Thermal Conductive Glue

      

Electronic Epoxy Resin Adhesive

      
Quality High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive wholesale

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